MARCH VIA™ Series

VIA Series plasma treatment systems offer superior plasma treatment uniformity for printed circuit board (PCB) panels. Hero image: MaxVIA-Plus. The MaxVIA, MaxVIA Plus, ModVIA, and MegaVIA systems deliver various plasma cleaning, surface activation, and adhesion improvement capabilities to suit through-hole and blind VIA applications. You’ll receive your new system with minimal lead time when you choose a standard system package. The VIA Series: MaxVIA, MaxVIA Plus, and ModVIA packages: MegaVIA package: The MaxVIA system is optimized for high-volume PCB plasma treatment, ensuring exceptional etchback and desmear uniformity. Its advanced power-power electrode configuration enhances process consistency. Building upon MaxVIA, the MaxVIA-Plus system increases throughput with enhanced plasma treatment capabilities. It supports a broader range of PCB sizes and delivers faster cycle times. The MegaVIA system is designed for large-scale PCB plasma treatment, handling panels up to 30 x 52 inches with superior plasma uniformity and optimized gas flow for high-aspect-ratio applications. The ModVIA system is ideal for low-volume, high-mix production and R&D applications. Its scalable plasma cell design allows flexible processing of small to medium PCB batches. You can be confident when choosing Nordson Electronics Solutions as your fluid dispensing partner. Our commitment to innovation, investment in R&D, and customer service excellence allow us to deliver performance and reliability consistently.