SELECT Board Warp Sensing

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Laser-Based Measurement for Improved Process Control Overview. The Board Warp Sensing system measures the height differences of a printed circuit board assembly as it is preheated and calculates the downward deflection. The system automatically corrects all Z-axis values compensating for any warpage of the printed circuit board and eliminates the need for traditional and labor-intensive manual adjustment of the soldering program. Data from the Board Warp Sensing system is input into the PhotoScan software, which automatically adjusts Z-axis program values, compensating for any board deflection. Integrated Solution. The Board Warp Sensing system fully integrates with closed-loop process controls contained in Nordson SELECT’s PhotoScan software providing seamless operation for your selective soldering process. Nordson SELECT’s closed-loop process controls enable successful results for a full range of soldering applications and ensure stable and repeatable results for high-yield production. Experience. With over a decade of selective soldering experience and more than a thousand systems currently in production, Nordson SELECT is committed to providing innovative solutions for all selective soldering needs. Our global support network, including state-of-the-art application development labs, provides customers with world-class know-how and application expertise. Compatible with Cerno® 508.1, Integra® 508.2, 508.3, 508.4 and 508.5 models