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ProductsASYMTEK DV-7000 Heli-Flow Pump
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ASYMTEK DV-7000 Heli-Flow Pump

Brand

Nordson
NordsonVisit Website

Category

Pumps and Pump Systems

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The DV-7000 Heli-Flow® pump is an encoded auger pump with a floating head designed to make fast, repeatable dots The DV-7000 Heli-Flow® Pump is available in a luer- or footed-needle design with interchangeable cartridges, allowing each pump to work with several different fluid types. The DV-7000 has a hardened auger for use with filled epoxy materials and features a high flow rate. Footed needle cartridges feature an accurate and consistent gap between the needle tip and the foot. The foot contacts the board, and the gap ensures that the pump dispenses fluid at a programmable distance from the board surface and compensates for variations in the board's surface, providing fast small-dot dispensing. Typical applications include solder paste, silver epoxy, and dispensing small-dot surface mount adhesives. Luer-lock needle cartridges use the needle with a height sensor to set the gap between the board surface and needle tip, and is ideal for applications when the needle can't touch the board. Applications include dam writing, area fills, glob top, and lid seal. The quick-release cartridge design of the DV-7000 makes cleaning easy. Simply press the quick-release lever to remove the needle and cartridge. No tools are required. To use a different fluid type, simply change the cartridge, needle, and disposable fluid line. Nordson ASYMTEK's other auger pumps - the DV-8000/DV-8000C with their fixed-head design - are ideal for high flow rate encapsulation and lid seal applications. The DV-7000 pump is interchangeable with DV-8000/DV-8000C cartridges, although only the DV-7000 can use footed cartridges. All three pumps cover a wide range of dispensing applications to provide flexible process solutions. When configured with Nordson ASYMTEK dispensing systems, the DV-7000 pump is ideal for the manufacture of Micro-Electromechanical Systems (MEMS), optics, Micro-Opto-Electromechanical Systems (MOEMS), hybrid components, disk drive heads, micro potting and other electronic component assemblies.

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