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Thermal Interface Materials (TIM)
Brand
Category
Thermal Compounds
Non-silicone thermal compounds are widely used in electronic and electromechanical applications because they offer resistance to thermal cycling degradation. Our thermal compounds are formulated to provide excellent heat transfer, long shelf-life stability, and are RoHS and REACH compliant (lead-free).
Specifications
Other
Formula52022
AppearanceSmooth, off-white paste
Shelf Life1 year
Flow Rate: g/min4 to 7
Bleed: 24 Hrs., % Weight0.1
Viscosity: 25° C kCps460
Viscosity: 50° C kCps400
Minimum Bond Line: mm0.0381
Operating Temperature: ° C-40 to 200
Specific Gravity at 25° C2.7
Dielectric Strength: V/mil305
Volume Resistivity: Ohm-cm1.65x10^14
Thermal Conductivity: W/m-K0.92
Dissipation Factor: 25° C, 1000Hz0.0029
Evaporation: 150C, 24 Hrs., % Weight0.15
Dielectric Constant: 25° C, 1000Hz4.5