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AXI DPCT
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Nordson TEST and INSPECTION
As manufacturing requirements become ever more stringent, the capabilities and throughput of inspection solutions must continue to rise, to meet the demand and help manufacturers realise the ultimate goal of zero-defect parts. AXI Dynamic Planar CT is Nordson's superior software acquisition mode which improves yields. processes and productivity. Semiconductor packages for wire, micro-BGA and flip chip bump inspection A unique advanced algorithm library is available for the inspection of: Electronic components and solder joint A unique advanced algorithm library is available for electronic applications, specifically for component and solder-joint inspection on PCB, hybrid or chip level assembly processes. All standard SMD and THT/PTH components: Electronic components, solder joints and IGBT products A unique advanced algorithm library is available for electronic applications, specifically for component and solder-joint on PCB and IGBT multi-layer void inspection.