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Thermal Interface Materials (TIM)

Name: Thermal Interface Materials (TIM)
Brand: Nordson
Availability: InStock

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Thermal Compounds

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Non-silicone thermal compounds are widely used in electronic and electromechanical applications because they offer resistance to thermal cycling degradation. Our thermal compounds are formulated to provide excellent heat transfer, long shelf-life stability, and are RoHS and REACH compliant (lead-free).

Spesifikasi

Other

Formula52022

AppearanceSmooth, off-white paste

Shelf Life1 year

Flow Rate: g/min4 to 7

Bleed: 24 Hrs., % Weight0.1

Viscosity: 25° C kCps460

Viscosity: 50° C kCps400

Minimum Bond Line: mm0.0381

Operating Temperature: ° C-40 to 200

Specific Gravity at 25° C2.7

Dielectric Strength: V/mil305

Volume Resistivity: Ohm-cm1.65x10^14

Thermal Conductivity: W/m-K0.92

Dissipation Factor: 25° C, 1000Hz0.0029

Evaporation: 150C, 24 Hrs., % Weight0.15

Dielectric Constant: 25° C, 1000Hz4.5

Unduhan

Guide Thermal Compound Selection Guide Thermal Compound Selection Guide Thermal Compound 52022 Thermal Compound 52050 Thermal Compound 52054 Thermal Compound 52055 Thermal Compound 52160 Thermal Compound 53053 Thermal Compound 53054

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